The SimpleLink™ Wi-Fi® CC3200 Audio BoosterPack enables the evaluation and development with the digital audio peripheral [I2S] present on the SimpleLink Wi-Fi CC3200 device. This BoosterPack can be used along with the SimpleLink Wi-Fi...

SPECIAL NOTES: To update the firmware on your CC3100 device, use radio performance tools, perform network processing logs for advanced debugging, or use the TI SimpleLink™ Studio for CC3100 MCU emulator (PC-based), you will also need the...

To get started developing with this LaunchPad: Step 1: Buy the MSP-EXP432E401Y LaunchPad Step 2: Download the MSP432 SDK Step 3: Complete the Out-of-Box experience and take the SimpleLink Academy trainings The SimpleLink™ Ethernet...

The third party provider DLP Design NFC/RFID BoosterPack (DLP-7970ABP) is an add-on board designed to fit all of TI’s MCU LaunchPads. This BoosterPack allows the software application developer to get familiar with the functionalities of...

The MSP-EXP430FR5994 LaunchPad™ Development Kit is an easy-to-use evaluation module (EVM) for the MSP430FR5994 microcontroller (MCU). It contains everything needed to start developing on the ultra-low-power MSP430FR5x FRAM...

Ultra-low-power FRAM technology now joins the LaunchPad family. The MSP-EXP430FR5969 LaunchPad Development Kit is an easy-to-use microcontroller development board for the MSP430FR5969 MCU. It contains everything needed to start...

The MSP-EXP430FR2433 LaunchPad™ Development Kit is an easy-to-use evaluation module (EVM) based on the MSP430FR2433 Value Line Sensing microcontroller (MCU). It contains everything needed to start developing on the ultra-low-power...

The Hercules™ TMS570LS04 LaunchPad™ Development Kit is an inexpensive evaluation platform designed to help users evaluate and get started on development with Hercules microcontroller platform. The LaunchPad Development Kit is based on...

The Hercules™ RM42 LaunchPad™ is an inexpensive evaluation platform designed to help users evaluate and get started on development with Hercules microcontroller platform. The Launchpad Development Kit is based on the IEC 61508 SIL 3...

The GPIO Breakout Booster Pack is a low-cost IO breakout board for Tiva™ C Series Launch Pad Booster Pack XL pin out. Every available signal is connected to a 0.1-inch header position in addition to the majority being connected to 3.5-mm...

The LDC1000EVM (Evaluation Module) demonstrates the use of inductive sensing technology to sense and measure the presence, position or composition of a conductive target object. The module includes an example of a PCB sensor coil. An...

This BoosterPack kit contains one "EM Adapter BoosterPack". The purpose of the EM adapter board is to provide an-easy-to-use bridge between any of the TI MCU LaunchPads and the wide variety of TI RF evaluation modules (EM), for instance...